Which Includes Rigid, Flex and Rigid-Flex

Flex/Rigid-Flex Technology OverviewAreospace Printed Circuit Boards

Technology in our industry is constantly evolving. It’s not good to become complacent with your accomplishments and believe that you’ve reached the pinnacle of technology. The industry will pass you by. We believe in living by the words “Continuous Improvement.” There’s always room for innovation, for finding a more cost-effective solution that reduces cycle time and produces a better quality product for our customers. Therefore, in order to continue to meet these demands, we invest in equipment, in people, and in time to uncover that innovation. It leads us to say “YES” to our customer’s demands now and the vision to say yes to the next generation of technology.

APCT is proud to say yes to a Broad Range of Technologies. Our commitment to R & D and continued investment in equipment and people ensure robust solutions for our valued customers. The commitment to saying yes has not only led us to higher layer counts in through-hole technology, it has lead us to say yes to advanced and emerging technologies.

Rigid Technology Overview

APCT has divided the technology world into Standard, Advanced, and Development. There are many attributes responsible for determining which category a board is placed. However, for the purposes of this overview, the following are offered:

Standard TechnologyThrough-Hole technology up to 28 layers
HDI technology up to 3 lamination cycles
Advanced TechnologyThrough-Hole technology up to 38 layers
HDI technology up to 5 lamination cycles
Development TechnologyThrough-Hole technology up to 40 layers
HDI technology up to 7 lamination cycles

“Our business model demands that we say ‘YES’ to our customers.” – Steve Robinson, President/CEO

Therefore, we strive to support leading edge technology, such as HDI designs, and continue to meet and exceed the competitive turn-around times requested by our customers. We are determined to be a true partner that not only says yes to a broad range of technologies, but supports the build with the requested lead time at a competitive price point. Because technology and lead times are linked at APCT, we are very proud to say that we consistently produce “standard” technology faster than anyone in the world! APCT is designed to meet our commitment to “Best in Class” cycle times and to support virtually any rigid printed circuit board requirement for our customer. Please reach out to us today to lay the foundation of a strong partnership.

Flex/Rigid-Flex Technology Overview

Flex/Rigid-Flex Technology Overview

APCT is always looking to the next generation of technology and the ability to say “YES” to what their customers need. Our goal is to always offer a Broad Range of Technology; with that said, we are pleased to offer our customers Flex and Rigid/Flex products.

Flexible circuits are members of the electronic and interconnection family. They consist of a thin insulating polymer film having conductive circuit patterns affixed thereto and typically supplied with a thin polymer coating to protect the conductor circuits. The technology has been used for interconnecting electronic devices since the 1950s in one form or another. It is now one of the most important interconnection technologies in use for the manufacture of many of today’s most advanced electronic products.

In practice there are many different kinds of flexible circuits including: Single-sided flex circuits, Double-sided flex circuits, Multilayer flex circuits and the more exotic Double access or back bared flex circuits and Sculptured flex circuits.

These designs can naturally move into a “Rigid Flex” application. Rigid Flex printed circuit boards are boards using a combination of flexible and rigid-board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application.

To assist this initiative, APCT would like to offer the following support:

  • IPC 6013 type 4 class 3 for high reliability commercial and military.
  • Flex Layer Counts from 2 to 12+ layers.
  • Rigid Flex Layer Counts from 4 to 26+ layers.
  • Standard Panel sizes up to 18 x 24. Specialty sizes: 24 x 28+ as needed.
  • Back Drill Depth Tolerances from .005″ down to .002″
  • Full engineering DFM support.
  • Bookbinder construction capability.
  • Silver shielding and hybrid materials capability.