Technology

Technology in our industry is constantly evolving.  Rather than becoming complacent, we push ourselves to further advance our technology capabilities daily. 

Technology Overview-min
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Technology Overview

Because Technology is ever evolving, APCT lives by the mantra of “Continuous Improvement.” There’s always room for innovation, for finding a more cost-effective solution that reduces cycle time and produces a better-quality product for our customers.  It is because of this commitment that we continue to invest in the resources of equipment, people, and time to uncover that innovation. It leads us to say “YES” to our customer’s demands of the present and the vision to say yes to the next generation of technology.

APCT is proud to offer a Broad Range of Technologies. Our commitment to R & D and the continued investment in equipment and people, ensure robust solutions for our valued customers. Specifically, our technology capabilities include standard rigid through-hole technology through higher layer counts; the very advanced High Density Interconnect (HDI) product, including up to 7 lamination cycles, and the offering of Flex and Rigid Flex solutions.

 

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The Categories of Technology-min

The Categories of Technology

APCT has divided the technology world into Standard, Advanced, and Development. There are many attributes responsible for determining which category a board is placed. However, for the purposes of this overview, the following are offered:

Standard Technology:
  • Through-Hole Technology up to 28 layers
  • HDI Technology up to 3 lamination cycles
  • Flex Technology up to 6 layers
  • Rigid Flex Technology up to 14 layers
Advanced Technology:
  • Through-Hole Technology up to 38 layers
  • HDI Technology up to 5 lamination cycles
  • Flex Technology up to 10 layers
  • Rigid Flex Technology up to 24 layers
Development Technology:
  • Through-Hole Technology up to 40+ layers
  • HDI Technology up to 7+ lamination cycles
  • Flex Technology up to 12+ layers
  • Rigid Flex Technology up to 26+ layers

Corporate Manufacturing Capabilities

ATTRIBUTESSTANDARDADVANCEDDEVELOPMENT (NPI ONLY)
Panel Sizes12 x 18, 18 x 24, 21 x 2420 x 2621 x 27
Rigid Layer Counts2 – 2830 – 3840 +
Flex Layer Counts2 – 68 – 1012 +
Rigid Flex Layer Counts4 – 1416 – 2426 +
Cavity Sizes1.0″ x 1.0″.750″ x .750″< .500″ x .500″
LAMINATES – MATERIALSSTANDARDADVANCEDDEVELOPMENT (NPI ONLY)
Pb Free RoHs – 180 Tg FR4YesYesYes
Med Loss – FR408 HR, -13EPYesYesYes
Low Loss – 13EPSI, I-SpeedYesYesYes
Ultra Low Loss – Meg 6, I-TeraYesYesYes
PolyimideYesYesYes
Rogers LaminatesYesYesYes
Flex – Dupont APYesYesYes
Flex – Dupont LFYesYesYes
Flex – Dupont FRYesYesYes
Halogen FreeYesYesYes
IMAGED TRACE / SPACE / PADSTANDARDADVANCEDDEVELOPMENT (NPI ONLY)
Internal Line Width.003″.002″.0015″
Internal Spacing.003″.002″.0015″
External Line Width.003″.002″.0015″
Internal External Spacing.003″.002″.0015″
Minimum Pad.015″.010″.008″
Impedance Tolerance10%5%<5%
SMT Pitch.010″.008″.006″
VIA – PTH TOLERANCESSTANDARDADVANCEDDEVELOPMENT (NPI ONLY)
Smallest Drilled Via.0079″.005″.004″
Aspect Ratio10:114:118:1
Minimum Cu Clearance to Hole.008″.006″.004″
PTH Tolerance [+/-].003″.002″.0015″
NPTH Tolerance.001″.001″.001″
Back Drill Depth Tolerance.005″.003″.002″
HDI CAPABILITIESSTANDARDADVANCEDDEVELOPMENT (NPI ONLY)
Sequential Lamination3x Lam Cycles5x Lam Cycles7x Lam Cycles
Laser Micro Vias.0045″.003″.003″
Blind Aspect Ratio.75:11:11.2:1
Blind/Buried Vias.004″.003″.003″
Via in PadEpoxy or Copper Filled
Laser Routing Board Thickness<.040″.040″ – .062″.062″ +
SOLDER MASK-NOMENCLATURESTANDARDADVANCEDDEVELOPMENT (NPI ONLY)
Taiyo LPIGreen, Blue, RedBlack, WhiteAll Colors
Minimum Clearance.003″.003″.003″
Minimum Web.003″.003″.003″
Legend ColorWhiteBlack, Yellow, OrangeAll Colors
TEST & MEASUREMENTSTANDARDADVANCEDDEVELOPMENT (NPI ONLY)
Flying Probe TestYesYesYes
Fixture TestYesYesYes
TDRYesYesYes
IonicsYesYesYes
CMI XRFYesYesYes

Material Sets

The materials used in a rigid PCB design have a direct impact on its functionality. In Silicon Valley, technology moves at a rapid pace and demands that its components keep up. That’s why we create our PCBs with the highest quality materials and are constantly seeking new techniques and improvements on our current designs.

This philosophy was a driving force behind saying “Yes” to Isola’s Certification Program. They needed a PCB house to test and verify the ability of their new high-speed material sets of I-Tera MT and I-Speed. APCT partnered with Isola and thus in March of 2014, became the first candidate to be accepted for qualification in their new certification program. The partnership with the Isola Group is yet another example on how we intend to fortify our commitment to our customers; providing them with the “Best in Class” emerging material sets, with outstanding electrical performance, reliable thermal properties, with very robust manufacturing capabilities.

Our current material offerings (APCTs Material Comparison Chart Rev September 2018) include Standard FR4, lead‐free ROHS options, high-speed digital solutions, high frequency RF solutions, hybrid or mixed packages, heavy copper to 4 ounces, and more. Among these offerings, you’ll find polyimide, epoxy, halogen-free, low loss, glass, ceramic, hydrocarbon, buried capacitance, a range of FR4 high temp options, and others.

Of course we work with other approved materials from vendors like:

Ventec, ITEQ, Nelco, EMC, Grace, Nanya, Panasonic, Rogers, FaradFlex, and Taconic.

Our goal, as always, is to provide you the best service and level of customization to meet your needs. For questions about your specific PCB or HDI PCB requirements, please contact one of our DFM Engineers today.

We know that technology is ever-changing. In supporting the Defense & Aerospace industry for years, we need to partner with suppliers that push the envelope of technology as we do. APCT is an outstanding partner to Mercury. Their technology, flexibility and engineering team is Best in Class.”
Signed,

Mercury Systems
www.mrcy.com